BGA is an IC package that increases the capacity by two to three times without changing the memory capacity, and is usually used for memory chips. Compared with TSOP chips, BAG chips are smaller in size and have better heat dissipation and electrical performance. The frequency of use has also greatly increased, a lot of BGA chip in the patch, do not know whether it is stuck or the chip itself is bad, there will be the motherboard does not boot, and maintenance, usually need to replace BGA, to analyze the reason. In order to verify whether the IC is OK, we need to use tools to test, so the tools for testing BGA are what we call BGA test fixture, BGA test seat, BGA test rack, etc.
After using BGA test seat for a long time, some tin slag or dust will remain on the tip of the needle, resulting in unstable test; You can use an anti-static brush, dipped in anhydrous alcohol, gently brush the residue on the probe, if conditions can be used to blow the socket probe area, the effect is better; All custom test seats and test fixtures, if in normal use, are provided with three months of free maintenance, because the probe is worn parts, according to the actual use; The probe burns out or other parts are damaged due to the high current caused by the short circuit inside the chip, which is not covered by the free warranty; For products with a free warranty period of more than three months, paid maintenance services will be provided according to the actual situation. Custom BGA test seat process. Understand the packaging parameters and test requirements of the corresponding chip of the customized BGA test seat; The sales staff will sort out the customer information and send it to the engineering evaluation department for feasibility evaluation and quotation.
The selection of the test probe, whether it can access the characteristics, and ensuring a certain degree of accuracy during the contact process are the concerns of the user. At present, there are many kinds of probes, different shapes, different materials.
Test needle is also called test probe in industry. It is divided into spring probe (special probe) and universal probe for PCB test. When the spring probe is used, the test mold should be made according to the wiring condition of the PCB board to be tested. Generally speaking, only one PCB board can be tested per mold. Universal probes in use, only need to have enough points, so now many manufacturers are using universal probes; Spring pins are divided into PCB probe, ICT probe and BGA probe. PCB probe is mainly used for PCB board testing, ICT probe is mainly used for online testing after plugging, BGA probe is mainly used for BGA package testing and chip testing.
The probe tests the surface of the gold plated, inside the average life of 30,000 to 100,000 times of high performance springs. At present, the materials used are W and ReW, which are generally elastic, easy to offset, stick to the gold dust, and need to be cleaned several times. Wear and tear needle length, life is average. Next, let's look at the purpose and type of detection probe.
BGA test bench is a fixture for testing BGA encapsulated chips. In addition to the common spot, the BGA test stands on the market are not spot, need to be customized. So BGA test bench: What are the features and prices of BGA test bench? What are the features and prices of the BGA test bed?
Lanyi Electronics - Semiconductor Test Probe Manufacturing Plant
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