Industry dynamics-Dongguan Lanyi Electronic Technology Co., Ltd.

Independent research and development of non-magnetic probe, non-stick tin probe has been successfully used in aviation, military, medical and other industries, has become the core components of modern high-tech electronic products. The products are mainly used in the testing of various electronic and peripheral products, such as semiconductor components, CPU chips, PCB circuit boards, LCD screens, Camera cameras, IOT. Online testing of Internet of Things cars and other peripheral electronic products.

Introduction to BGA Test Seat

BGA is an IC package that increases the capacity by two to three times without changing the memory capacity, and is usually used for memory chips. Compared with TSOP chips, BAG chips are smaller in size and have better heat dissipation and electrical performance. The frequency of use has also greatly increased, a lot of BGA chip in the patch, do not know whether it is stuck or the chip itself is bad, there will be the motherboard does not boot, and maintenance, usually need to replace BGA, to analyze the reason. In order to verify whether the IC is OK, we need to use tools to test, so the tools for testing BGA are what we call BGA test fixture, BGA test seat, BGA test rack, etc.

2022-11-28

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BGA test seat production process

After using BGA test seat for a long time, some tin slag or dust will remain on the tip of the needle, resulting in unstable test; You can use an anti-static brush, dipped in anhydrous alcohol, gently brush the residue on the probe, if conditions can be used to blow the socket probe area, the effect is better; All custom test seats and test fixtures, if in normal use, are provided with three months of free maintenance, because the probe is worn parts, according to the actual use; The probe burns out or other parts are damaged due to the high current caused by the short circuit inside the chip, which is not covered by the free warranty; For products with a free warranty period of more than three months, paid maintenance services will be provided according to the actual situation. Custom BGA test seat process. Understand the packaging parameters and test requirements of the corresponding chip of the customized BGA test seat; The sales staff will sort out the customer information and send it to the engineering evaluation department for feasibility evaluation and quotation.

2022-11-16

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Test probe related introduction

The selection of the test probe, whether it can access the characteristics, and ensuring a certain degree of accuracy during the contact process are the concerns of the user. At present, there are many kinds of probes, different shapes, different materials.

2022-11-16

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