Independent research and development of non-magnetic probe, non-stick tin probe has been successfully used in aviation, military, medical and other industries, has become the core components of modern high-tech electronic products. The products are mainly used in the testing of various electronic and peripheral products, such as semiconductor components, CPU chips, PCB circuit boards, LCD screens, Camera cameras, IOT. Online testing of Internet of Things cars and other peripheral electronic products.

The advantages of IC test seat?



An IC test socket is a standard test device used to test the electrical performance and electrical connections of on-line components to check for manufacturing defects and defective components. So what are the advantages of IC test seat design?


IC test seat compact, stable, unique design, small size, can meet the needs of any motherboard components high density;


The test seat is mostly fixed with nuts, which is more conducive to disperses the welding force between IC test seat and PCB board, greatly improving the reliability and service life of the connection. And the fixed cover is made of aluminum alloy material, which can effectively dissipate heat and greatly improve the effect of IC test. When the chip is fixed, the screw cap method is used to better buffer the connection pressure between the test seat and the circuit board, which is not easy to cause air welding. Reasonable design makes the connection more reliable and humanized, makes the test more convenient and quick, and greatly improves the work efficiency. Now commonly used computer motherboard, graphics card, communication, industrial control, memory DDR1, DDR2, DDR3, digital products and other BGA chips can be customized BGA test seat for testing.


How to choose the right IC test seat?


The probe of IC test seat adopts imported probe, the elastic expansion of the needle is smoother, which can ensure the higher service life of the measured number;


Design maintenance is simple and fast, the probe can be replaced at will; Such IC test seat from the use, maintenance, price and other aspects have great advantages than similar products, is very humanized. Good choice.


Test requirement


In order of test difficulty:


Basic test: test whether IC is good (such as NAND Flash BGA152 BGA132 test);


Write work: used to write firmware to the chip (such as QFP32 chip needs to write its MCU "bin");


High-frequency testing: RF chips need to operate at high frequencies (such as QFN32 communication chips, which need to operate to 4GHz).


High frequency and high temperature: Military grade communication chips need to be tested in a polar environment.


Full function test: Suitable for IC design or electronic equipment research and development laboratories or companies (online chip test).


Now IC testing requirements are increasingly high, so many IC manufacturers and IC closed test enterprises need to find suitable for their own needs of the IC test seat. Now IC testing is more and more strict. It will confirm the life cycle of the IC and the useful life and function of the device it uses. So its requirements will determine the raw materials and cost of IC test seat. Now the test requirements are varied, the corresponding test socket is also varied.