Tech Breakthrough: LANYI Electronics Granted Patent for Automated Optical Inspection (AOI) Technology, Dramatically Enhancing Testing Efficiency
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LANYI Electronics Marketing Department
DONGGUAN, China – March 19, 2025 – According to the latest disclosure from the China National Intellectual Property Administration (CNIPA), Dongguan LANYI Electronics Technology Co., Ltd. has been officially granted a patent for its self-developed "Probe Automatic Optical Inspection (AOI) Machine" (Authorized Announcement No.: CN222625414U). This patent marks a major milestone for LANYI Electronics in the field of automated inspection for semiconductor test probes.
Addressing the Bottlenecks of Precision Testing
Semiconductor test probes are ultra-precision electronic components that have traditionally relied on manual visual inspection. This conventional method is often limited by low efficiency and human error, which can hinder large-scale production.
LANYI's newly patented AOI system revolutionizes this process by utilizing a vibrating tray for automated feeding, multi-angle optical dimension measurement, and advanced surface defect detection. The result is a fully automated, high-speed inspection pipeline.
Core Technical Advantages:
- 360-Degree Comprehensive Coverage: The system performs precise captures of the probe's sides, the top at a 45-degree angle, and the bottom. This ensures that dimensional variances and surface defects are identified with total accuracy.
- Enhanced Efficiency & Cost Reduction: By significantly shortening inspection cycles and increasing precision, the system effectively reduces labor costs and accelerates the integration of AI with automated manufacturing.
Strengthening Full-Chain R&D and Production
The approval of this patent further solidifies LANYI Electronics' full-chain self-development capabilities—spanning probe R&D, manufacturing, and quality control. This technological moat provides a solid foundation for achieving high-volume, high-quality mass production for the global semiconductor market.
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