LANYI Electronics Secures Series B+ Funding Led by Shenzhen Capital Group to Scale Semiconductor Test Probe Capacity_Dongguan Lanyi Electronic Technology Co., Ltd.

Independent research and development of non-magnetic probe, non-stick tin probe has been successfully used in aviation, military, medical and other industries, has become the core components of modern high-tech electronic products. The products are mainly used in the testing of various electronic and peripheral products, such as semiconductor components, CPU chips, PCB circuit boards, LCD screens, Camera cameras, IOT. Online testing of Internet of Things cars and other peripheral electronic products.

LANYI Electronics Secures Series B+ Funding Led by Shenzhen Capital Group to Scale Semiconductor Test Probe Capacity

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LANYI Electronics Marketing Department

DONGGUAN, China – January 14, 2025

Dongguan LANYI Electronics Technology Co., Ltd., a premier provider of semiconductor testing solutions, has successfully closed its Series B+ financing round. The round was led by Shenzhen Capital Group (SCGC), with participation from the Social Security Fund Bay Area Tech-Innovation Equity Investment Fund and other prominent institutional investors.

Strategic Expansion in High-Precision Testing

The proceeds from this round will be primarily utilized to accelerate the expansion of the company's manufacturing capacity and to capture a larger share of the global semiconductor test probe market.

As a leader in the domestic high-precision testing sector, LANYI Electronics offers a comprehensive product portfolio, including:

Semiconductor Test Probes & BGA Probes

RF Probe Modules

Wafer Test Probe Cards

LCD Module Test Probes

These solutions are critical components in the testing life span of integrated circuits (ICs), display modules, and advanced electronic consumer products.

Sustained Capital Momentum

The leading role of Shenzhen Capital Group (SCGC), a top-tier state-owned venture capital firm specializing in strategic emerging industries such as semiconductors and advanced manufacturing, underscores strong market confidence in LANYI's technical prowess and operational excellence.

Since its Series A round in 2022, LANYI Electronics has maintained a robust financing trajectory:

Series A+ (July 2023): Backed by TSST Asset Management and Dazheng Intelligent Investment.

Series B (June 2024): Supported by Shenzhen Furong Xinchi Investment.

Series B+ (January 2025): Led by SCGC and the Bay Area Tech-Innovation Fund.

Future Outlook

"This successful funding round marks a significant milestone in our journey toward becoming a world-class semiconductor testing partner," the company stated. "With the continued support of our investors, LANYI Electronics will further enhance its R&D capabilities, optimize production efficiency, andcontribute to the resilience and innovation of the global semiconductor supply chain."

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