Classification of test probes_Dongguan Lanyi Electronic Technology Co., Ltd.

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Independent research and development of non-magnetic probe, non-stick tin probe has been successfully used in aviation, military, medical and other industries, has become the core components of modern high-tech electronic products. The products are mainly used in the testing of various electronic and peripheral products, such as semiconductor components, CPU chips, PCB circuit boards, LCD screens, Camera cameras, IOT. Online testing of Internet of Things cars and other peripheral electronic products.

Classification of test probes

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Probes can be classified according to electronic testing purposes:

A. optical circuit board test probe: circuit board test before installation of components and only open and short circuit detection probe, most of the domestic probe products can replace imported products;

B. Online test probe: detection probe after the PCB circuit board is installed; The core technology of excellent products is still in the hands of foreign companies. Some domestic probe products have been developed successfully, which can replace imported probe products.

C. Microelectronic testing probe: that is, wafer testing or chip IC testing probe. The core technology is still in the hands of foreign companies, and domestic manufacturers actively participate in research and development, but only a small part of the successful production.

Main types of probes: cantilever probes and vertical probes.

Cantilever probes: Blade Type and Epoxy Type

Vertical probe: Vertical Type

1. ICT series Probes

The general diameter is between 0.54mm-1.27mm, there are standard names in the industry 100mil, 75mil, 50mil, and more special diameter is only 0.19mm, mainly used for online circuit testing and functional testing. Also known as ICT testing and FCT testing. It is also a kind of probe widely used at present.

2. Interface Probes

Non-standard probes are typically made for a small number of customers who make large test machines, such as Teradyne and Agilent. Used for the contact point and surface between the test machine and the test fixture.

3. MicroSeries Probes

The center distance between the two test points is generally 0.25mm to 0.76mm.

4. Switch Probes

A single probe has two currents.

5. Coaxial Probes

Used for testing high-frequency signals, with a shield ring can be tested within 10GHz and 500MHz without a shield ring.

6. Rotator Probes

The elasticity is generally not high because of its inherently strong penetration and is commonly used in OSP-treated PCBA tests.

7. High Current Probes

The diameter of the probe is between 2.54mm-4.75mm. The maximum test current can reach 39amps.

8. Semiconductor Probes

The diameter is generally between 0.50mm and 1.27mm. Bandwidth greater than 10GHz, 50Ω characteristic.

9. Battery and Connector Contacts

Generally used to optimize the contact effect, good stability and long life. In addition to the above types, there are temperature probe, Kelvin probe and so on, which are rarely used.