The composition structure of ICT probe_Dongguan Lanyi Electronic Technology Co., Ltd.

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Independent research and development of non-magnetic probe, non-stick tin probe has been successfully used in aviation, military, medical and other industries, has become the core components of modern high-tech electronic products. The products are mainly used in the testing of various electronic and peripheral products, such as semiconductor components, CPU chips, PCB circuit boards, LCD screens, Camera cameras, IOT. Online testing of Internet of Things cars and other peripheral electronic products.

The composition structure of ICT probe

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The commonly used ICT test probe is composed of needle, outer tube and spring. Because the ICT probe pays great attention to its conductivity, durability and hardness, electroplating is a very important part in the manufacturing process. Before assembly, the parts are specially electroplated so that a probe with acceptable electrical parameters can be assembled.

The gilding of the probe is also exquisite, the whole part of the needle tube is required to be gilded, including the inner wall and the outer wall. The plating of the needle tube is completed only when the inner and outer walls are all gilded. Many manufacturers do not electroplate springs due to cost, but if there is a high demand, springs also need to be electroplated.

On the other hand, ICT probes also need to be able to meet the characteristics of wear resistance and low impedance, so when selecting the basic materials, the needle is usually beryllium copper or SK-4, the needle is phosphor copper, the spring is steel wire, all the material surface gold plating.